IBM has announced that it will provide the microprocessors that will serve as the heart of the new Wii U system from Nintendo. Unveiled today at the E3 trade show, Nintendo plans for its new console to hit store shelves in 2012. The all-new, Power-based microprocessor will pack some of IBM’s most advanced technology into an energy-saving silicon package that will power Nintendo’s brand new entertainment experience for consumers worldwide. IBM’s unique embedded DRAM, for example, is capable of feeding the multi-core processor large chunks of data to make for a smooth entertainment experience. IBM’s state-of-the-art 300mm chip plant in East Fishkill, N.Y., will be the manufacturing facility for the new game chip the company is building for Nintendo’s new game console.
IBM plans to produce millions of chips for Nintendo featuring IBM Silicon on Insulator (SOI) technology at 45 nanometers (45 billionths of a meter).
The relationship between IBM and Nintendo dates to May 1999, when IBM was selected to design and manufacture the central microprocessor for the Nintendo GameCube™ system. Since 2006, IBM has shipped more than 90 million chips for Nintendo Wii systems.
Built on the open, scalable Power Architecture base, IBM custom processors exploit the performance and power advantages of proven silicon-on-insulator (SOI) technology. The inherent advantages of the technology make it a superior choice for performance-driven applications that demand exceptional, power-efficient processing capability – from entertainment consoles to supercomputers.